AGP Executive Report
Last update: 6 hours agoAdvanced Packaging Push: TSMC will build three more advanced packaging fabs in Phase II of Chiayi Science Park, aiming to meet rising HPC demand and expand a southern Taiwan AI/semiconductor corridor expected to drive over NT$300B in annual output once both phases run. AI Supply-Chain & Security: China’s MIIT warned that certain Anthropic Claude Code versions may secretly transmit users’ location and identifiers, urging uninstall/upgrade; meanwhile Meta shares slid after a Reuters report on plans to double computing capacity to 14GW by 2027 and start in-house AI accelerator production at TSMC in September. Taiwan in US Trade Data: The US trade deficit jumped to $77.6B in May as AI component imports rose; Taiwan is cited as a key source of advanced electronics, underscoring how Taiwan manufacturing feeds US AI buildouts. Memory Race in Asia: Micron broke ground on a ¥1.5T Japan HBM expansion, with shipments targeted around summer 2028, as global memory shortages keep pressure on AI hardware supply. Weather Disruption: Typhoon Bavi hit China’s Zhejiang coast, evacuating nearly 2.8M people and disrupting flights and rail; Taiwan also faced heavy rain and evacuations, a reminder that storms can quickly ripple into regional logistics. Food Safety Fallout: Taiwan health authorities withheld test results for 29 cooking-oil batches from Central Union Oil over sample falsification concerns, after a carcinogen-tainted oil scandal and fines.
Note: AI summary from news headlines; neutral sources weighted more to help reduce bias in the result. Feedback is welcome. Please let us know if you have any comments or suggestions about the AGP Executive Report.
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