AGP Executive Report
Last update: 2 hours agoAI Chips & Memory Race: Micron will pour $10B into Micron Research Labs in Boise to tackle memory bottlenecks for AI accelerators, with work spanning memory tech, compute architectures, packaging, and future manufacturing. Semiconductor Capacity & Pricing: Samsung raised 4nm (SF4) chipmaking prices up to 15% for new orders as AI demand tightens capacity, with Taiwan customers seeing smaller hikes. TSMC Footprint in the US: TSMC’s Arizona plant now tops 4% of group sales, underscoring how US production expansion is reshaping revenue mix. Robotaxi Hardware: Waymo is producing a custom chip for its robotaxis to boost sensor processing and reduce reliance on third-party suppliers; TSMC makes it on 5nm. Taiwan Exports: Taiwan’s July export orders jumped 61.9% YoY to a record $97.94B, led by ICT and electronics tied to AI demand. Cross-Strait Culture Industry: A cross-Strait film forum in Beijing highlighted closer cooperation on themes and formats, including TV and short-form series. Semicon Taiwan Buzz: Modutek will showcase wet processing and SmartFAB AI subfab management at Semicon Taiwan 2026. Defense Tech & Drones: Taiwan is moving to strengthen drone defenses and civil defense as Beijing pressure grows, with underwater drone cooperation also in focus.
Note: AI summary from news headlines; neutral sources weighted more to help reduce bias in the result. Feedback is welcome. Please let us know if you have any comments or suggestions about the AGP Executive Report.
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